Home
Add-ons
Simcenter STAR-CCM+ comes with add-ons that provide a dedicated approach for simulations of specific engineering applications—the Electronics Cooling Toolset and the Simcenter STAR-CCM+ In-cylinder Solution.
Electronics Cooling Toolset
The Electronics Cooling Toolset provides a simplified approach within Simcenter STAR-CCM+ to perform simulations of thermal management for electronics devices—from design to solution analysis.
Bibliography

Link: copied

Breadcrumb: copied

Add-ons
Simcenter STAR-CCM+ comes with add-ons that provide a dedicated approach for simulations of specific engineering applications—the Electronics Cooling Toolset and the Simcenter STAR-CCM+ In-cylinder Solution.
- Electronics Cooling Toolset
  The Electronics Cooling Toolset provides a simplified approach within Simcenter STAR-CCM+ to perform simulations of thermal management for electronics devices—from design to solution analysis.
  - Accessing the Electronics Cooling Toolset
    The Electronics Cooling Toolset is accessible by clicking a customized toolbar button in Simcenter STAR-CCM+.
  - Setting up an Electronics Cooling Simulation
    The following steps outline the recommended workflow to analyse electronic devices using the Electronics Cooling Toolset in Simcenter STAR-CCM+.
  - Electronics Cooling Toolset Reference
    The following sections provide definitions and settings for the various objects within the Electronics Cooling Toolset.
  - Electronics Cooling Toolset Formulation
  - Bibliography
- Simcenter STAR-CCM+ In-cylinder Solution
  Simcenter STAR-CCM+ In-cylinder Solution provides a simplified approach within Simcenter STAR-CCM+ to perform transient moving-mesh simulations of internal combustion engines (ICE).
- Application Productivity Tools
  Application Productivity Tools (APTs) are specialized add-ons that allow you to focus on specific applications. These tools are available as plugins for Simcenter STAR-CCM+.

Bibliography

[144]

JEDEC Solid State Technology Association, JEDEC Standard JESD15-1, "Compact Thermal Model Overview", October 2008.

[145]

Bar-Cohen, A. and Krueger, W.B., "Thermal Characterization of Chip Packages - Evolutionary Development of Compact Models" , Thirteenth Annual Semiconductor Thermal Measurement and Management Symposium - SEMITHERM XIII, Austin, TX, January 28-30, 1997 IEEE, pp. 180-197.