Defining the Setup
Set up the solution physics and materials for the solid components and the flow domain. For the solver, reduce the maximum number of iterations.
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Right-click the Edit.
node and select An additional Edit tab opens that displays the default ambient conditions, solution physics, and materials.
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Within the Solution Physics group box, set Solve to Forced Convection.
When solving for a forced convection problem, the Electronics Cooling Module by default solves for flow and energy in a turbulent flow regime.
Within the Materials group box, define the materials for the graphics card components:
- Next to the Solid Sim Materials box, click Select.
- Within the Select Materials dialog, in the Solid Simulation Materials box, select Al.
- In the table of material properties, set Thermal Conductivity to 167 W/m-K.
- Click Add Material.
- From the database of standard solid materials, select Si (Silicon) and click OK.
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Set the Si material properties to the following values:
Property Setting Thermal Conductivity 124 W/m-K Specific Heat 700 J/kg-K Density 2330 kg/m^3 - In the list of materials, select Si and click Duplicate Material.
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Select the added material and set the following properties:
Property Setting Material Name ABS Thermal Conductivity 2.5 W/m-K Specific Heat 2050 J/kg-K Density 1050 kg/m^3 -
Repeat steps 8 and 9 to create another solid material using the following properties:
Property Setting Material Name Alumina Thermal Conductivity 30 W/m-K Specific Heat 850 J/kg-K Density 3960 kg/m^3 - Click Apply and Close.
- Finish the setup by clicking Close at the bottom of the tab.
In this tutorial, the simulation converges within 500 iterations. To set the maximum number of iterations:
- Right-click the Edit. node and select
- Within the Stopping Criteria group box, set Maximum Steps to 500.
- Click Close.
Save the simulation:
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In the System toolbar (see Toolbar Reference), click
(Save).