Setting up the Heat Sources
Heat generated by the electronic components is represented in Simcenter STAR-CCM+ using total heat sources. Heat sources are set on regions.
The GPU chip emits 25 W of heat. Each memory chip emits 4 W of heat. You can allocate different heat sources to different parts in the same region using Per-Part Values.
-
Select the
True.
node and set
Allow Per-Part Values to
The Part Subgroupings node is added to the Solid Components node.
-
Expand the
node.
The Subgroup 1 node contains all the parts that make up the Solid Components region. These parts have no heat assigned to them.
- Rename Subgroup 1 to Default.
-
Right-click the
Subgrouping 1 node and select
New.
A new subgroup, Subgroup 1, is added to Subgrouping 1.
- Rename Subgroup 1 to GPU Chip.
- Select GPU Chip and set Objects to GPU Chip.
-
Create another subgroup with the following properties:
Property Setting Name Memory Chips Objects Memory Chip 1 Memory Chip 2 Memory Chip 3 Memory Chip 4 Memory Chip 5 Memory Chip 6 Memory Chip 7 Memory Chip 8
Modify the physics conditions to accept total heat source as the energy source:
- Expand the node.
- Select the Energy Source Option node and set Energy Source Option to Total Heat Source.
Set the heat sources for the solid components.
- Expand the node.
- Select the Heat Source node and set Method to By Part Subgroup.
-
Expand the
node.
The subgroups that you created appear here.
-
Edit the
By Part Subgroup node and set the following properties:
Node Property Setting Default Value 0.0 W GPU Chip Value 25.0 W Memory Chips Value 32.0 W Each memory chip emits 4 W of heat. There are 8 memory chips in this region, hence you multiply 4 W by the number of memory chips to get 32 W.
- Save the simulation.