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Add-ons
Simcenter STAR-CCM+ comes with add-ons that provide a dedicated approach for simulations of specific engineering applications—the Electronics Cooling Toolset and the Simcenter STAR-CCM+ In-cylinder Solution.
Electronics Cooling Toolset
The Electronics Cooling Toolset provides a simplified approach within Simcenter STAR-CCM+ to perform simulations of thermal management for electronics devices—from design to solution analysis.
Electronics Cooling Toolset Reference
The following sections provide definitions and settings for the various objects within the Electronics Cooling Toolset.
QuickParts
QuickParts describe the components of an electronics device and incorporate geometry, placement, and physics settings.
Interactions
Within the Electronics Cooling Toolset, an interaction allows you to remove volume from a QuickPart, to cut holes through QuickPart segments, or to split a QuickPart Surface.

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Add-ons
Simcenter STAR-CCM+ comes with add-ons that provide a dedicated approach for simulations of specific engineering applications—the Electronics Cooling Toolset and the Simcenter STAR-CCM+ In-cylinder Solution.
- Electronics Cooling Toolset
  The Electronics Cooling Toolset provides a simplified approach within Simcenter STAR-CCM+ to perform simulations of thermal management for electronics devices—from design to solution analysis.
  - Accessing the Electronics Cooling Toolset
    The Electronics Cooling Toolset is accessible by clicking a customized toolbar button in Simcenter STAR-CCM+.
  - Setting up an Electronics Cooling Simulation
    The following steps outline the recommended workflow to analyse electronic devices using the Electronics Cooling Toolset in Simcenter STAR-CCM+.
  - Electronics Cooling Toolset Reference
    The following sections provide definitions and settings for the various objects within the Electronics Cooling Toolset.
    - Setup
      The Setup manager node allows you to define the physics, default units, solver settings, QuickPart libraries, and ODB++ import environment for an electronics cooling simulation.
    - Parameters
      The Parameters node allows you to define, edit, and delete global parameters, which you can use in multiple Construction Geometries, QuickParts, or QuickPart Surfaces.
    - Construction Geometries
      The Construction Geometry manager node allows you to create and edit geometry objects.
    - QuickParts
      QuickParts describe the components of an electronics device and incorporate geometry, placement, and physics settings.
      - Import IDF Options Panel
        The Import IDF Options panel allows you to specify what components of the IDF file to import into the Electronics Cooling Toolset.
      - Heatsink
        Heat sinks cool electronic components by transferring the generated heat into the surrounding fluid.
      - Chip
        Chips are modules made of semiconductor material on which integrated circuits are embedded. Chips generate excess heat and thus require cooling to improve reliability and avoid premature failure.
      - PCB
        Printed circuit boards (PCBs) route signals and power between electronic components. They typically assemble conductive tracks and dielectric laminates in multiple layers.
      - Enclosure
        An enclosure houses the components of an electronics device and usually bounds the domain for the flow analysis.
      - Axial Fan
        Fans cool electronic devices by drawing cool air over the components' heat sinks. In axial fans, the gas flow is parallel to the fan's axis. They generally produce low pressures with high flow rates.
      - Radial Fan
        Fans cool electronic devices by drawing cool air over the components' heat sinks. In radial fans, the gas flow is perpendicular to the fan's axis. They generally produce high pressures and low flow rates.
      - Resistance
        A Resistance describes any electronic component that permits the passage of gas and generates heat.
      - Generic
        A generic QuickPart describes any component that does not correlate to one of the predetermined QuickPart categories.
      - Interactions
        Within the Electronics Cooling Toolset, an interaction allows you to remove volume from a QuickPart, to cut holes through QuickPart segments, or to split a QuickPart Surface.
      - Extract Volume
        An Extracted Volume part describes the domain that is enclosed within selected QuickParts or Construction Geometries.
      - QuickPart Surfaces
        Every QuickPart is composed of QuickPart Surfaces. By defining the boundary and interface types, and setting associated values, you can control how the QuickPart interacts with its surroundings.
      - QuickPart Libraries
        A QuickPart library allows you to save previously created QuickParts in order to restore them in new electronics cooling simulations.
    - Placement
      The Electronics Cooling Toolset offers various positioning capabilities for Construction Geometries and QuickParts.
    - Interactive Right-Click Actions
      The Electronics Cooling Toolset offers various interactive dimensioning and positioning capabilities for Construction Geometries and QuickParts.
    - Mesh
      The Mesh manager node allows you to define and control the volumetric discretization of the computational domain.
    - Scenes
      The Scenes manager node allows you to visualize the geometry, mesh, and solution data that are contained in the simulation.
    - Results
      The Results manager node allows you to compute and display summaries of solution data.
    - Field Functions
      The following field functions are made available to the electronics cooling simulation depending on the physics setup:
  - Electronics Cooling Toolset Formulation
  - Bibliography
- Simcenter STAR-CCM+ In-cylinder Solution
  Simcenter STAR-CCM+ In-cylinder Solution provides a simplified approach within Simcenter STAR-CCM+ to perform transient moving-mesh simulations of internal combustion engines (ICE).
- Application Productivity Tools
  Application Productivity Tools (APTs) are specialized add-ons that allow you to focus on specific applications. These tools are available as plugins for Simcenter STAR-CCM+.

Interactions

Within the Electronics Cooling Toolset, an interaction allows you to remove volume from a QuickPart, to cut holes through QuickPart segments, or to split a QuickPart Surface.

The following properties define the behaviour of an interaction:


Interaction			Example
Subtract	Allows you to remove the volume of one or more objects from the selected QuickPart. The subtracted objects are retained. Each object must share some of its volume with the QuickPart, otherwise the QuickPart remains unchanged. Solid Quick Objects Specifies the objects that remove material from the QuickPart. You can choose from QuickParts and Construction Geometries except for Sheet Construction Geometries.
Extrude Cut Through First Segment	Allows you to project one or more Sheet Construction Geometries in normal direction to cut holes through the selected QuickPart. The three-dimensional objects that are formed by projecting the sheet objects are subtracted from the first segment of the QuickPart. This is particularly useful for cutting openings in the enclosure of an electronic device. Sheet Construction Geometry Specifies the geometries that determine the shape and position of the holes. You can choose from any Sheet Construction Geometry or pattern of Sheet Construction Geometries.
Imprint	Allows you to imprint the profile of one or more Sheet Construction Geometries onto the surface of the selected QuickPart. The surface is split where the new lines are added. The QuickPart and the Sheet Construction Geometries must overlap by less than 1.0E-8 m, or have coincident faces, otherwise the QuickPart remains unchanged. This property enables you to create new QuickPart Surfaces on which you can specify custom mesh settings or physics conditions. Sheet Construction Geometry Specifies the objects that imprint their profile. You can choose from any Sheet Construction Geometry or pattern of Sheet Construction Geometries.